BondBlast® is specifically designed to remove bonding adhesive squeeze out on bonded aerospace panels leaving the substrate and protective coatings (i.e.; primer, alodine or anodizing) intact.

Due to the composition of BondBlast®, the bonding adhesive can be removed with virtually no detrimental residual stress to the substrate eliminating any warpage.

BondBlast® performs at a much faster rate than previously used products and the attrition rates and dust levels are much lower.

Size may be varied to accommodate needed application (softness of the substrate or thickness of the bonding material).

Physical Characteristic of BondBlast